Bath Module

Universal and easy to use option

The most common method is a test using a solder pot filled with the same alloy that is used in the production line. Solder pots are interchangeable when more than one solder alloy is in use. The device to be tested lowers with a defined speed into the molten solder. The exact position of the surface of the solder bath is determined by a non-contact laser sensor. A scraper removes all oxidation from the surface of the molten solder prior to each test.

Initially, dipping the test specimen into the molten solder causes solder displacement because the test specimen is at room temperature and the solder is not wetting the part yet. The displacement force is already measured. After the test specimen has reached the solder temperature, the wetting begins. The solder flows up the test specimen and the strong surface tension of the molten solder pulls the specimen down. These forces are measured precisely and are shown in a force-time curve on the monitor. All previous time data is available in a listing. The software calculates the measurements and provides the wetting force or meniscus angle. 

This value can be compared to the values of other specimens. The advantage of the software is that it compares the data of earlier (or future) tests of the same component from the database to show a quality trend.

 

Microtronic Solder bath option

Solder Bath Module