Paste Test module

Best used to quallify materials for the production inviroment

A revolutionary new method is available that tests using solder paste and a temperature profile. A component is placed on printed solder paste and heated through the same temperature profile that is used in production. All force parameters and values during the heating cycle are monitored and saved. This is the only known existing method of simulating and qualifying the solder profile of an in-line production solder furnace in conjunction with different solder pastes and components. The software is straightforward and allows the use of comprehensive component lists. The appropriate data sets can be generated, saved and edited for later use.



Microtronic Solder Paste Module

Solder Paste Module